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Axiomtek Malaysia — OEM/ODM Services
Custom Design & Manufacturing (OEM/ODM)
Full design-in across board, software, mechanical, and system design — from concept and prototyping to mass production. Leverage 30+ years of Axiomtek Taipei engineering with local support from Axiomtek Malaysia for Malaysia and Singapore projects.
- 30+ years design-in
- Board · Software · Mechanical · System
- Modular I/O & thermal design
- Malaysia & Singapore support
01 — Who this is for
Who is Axiomtek’s OEM/ODM service for?
Axiomtek’s custom design and manufacturing service is for engineering and procurement teams whose application needs a board, I/O mix, full system integration, thermal design, or certified variant that standard catalog hardware does not cover — typically buyers who have evaluated off-the-shelf industrial PCs and found a gap that matters to their deployment.
01
A board that doesn’t exist in the catalog
Your design needs a custom carrier board or a non-standard board-level configuration built around your application — industrial motherboards, SoMs, and SBCs with expandable layouts for high-performance CPUs, wireless, or multi-display support.
02
An I/O mix standard SKUs don’t offer
The standard product is close, but the combination of ports, expansion, or interfaces your deployment requires isn’t available off the shelf — power modules, ZIO, Mini PCIe, storage, and I/O boards can be arranged to the use case.
03
A full system, not only a board
From industrial PCs and HMI to machine vision and medical-grade systems, you need integrated hardware, rugged enclosure, thermal design, and embedded OS support as one solution for automation, transportation, healthcare, or network security.
04
A ruggedized or certified variant
Your environment — vibration, temperature, humidity, dust, or a target-market certification — calls for a variant outside the standard lineup, including thermal modules and enclosure-level protection.
02 — 100% customizable design solution
What does a full design-in engagement cover?
Axiomtek’s design-in service is a full design solution across the product life cycle — from design thinking and prototyping through mass production. The customer-centric approach combines board, software, mechanical, system, and industrial design so ideas about look, dimensions, and operation become a working solution with faster time to market and fewer technical hurdles.
- 01
Board design
Schematic and layout review, expandable board platforms, and carrier-board design around your mechanical, electrical, and thermal constraints.
- 02
Software design
Embedded OS, API utility and drivers, BIOS/UEFI customization, and optional Edge AI SDK support on applicable platforms.
- 03
Mechanical design
Enclosure, industrial design concept, dimensions, appearance, and user-interface packaging pulled together with the electronics.
- 04
System design
End-to-end system integration — CPU choice, I/O arrangement, storage, noise and ventilation, peripherals, and production readiness.
- 05
ID concept
Customer-centric industrial design: how the device should look and operate, including preferred colors, dimensions, and physical appearance.
03 — Capability overview
What does Axiomtek’s design-in service cover?
Axiomtek has earned its reputation as a full design service provider focused on complex customization and integration — embedded board and system solutions adaptable to application-specific markets. Scope includes board design assistance, I/O and modular accessories, all-in-one system integration, ruggedization and thermal design, embedded software and BIOS support, and certification validation. Work is carried out with Axiomtek Taipei’s design and manufacturing teams; specific timelines and certifications are confirmed during consultation.
Board design assistance
Full range of embedded board solutions across form factors: industrial motherboards, System on Modules (SoM), and single-board computers (SBC). Platforms are highly expandable — high-performance CPUs, wireless communication, multiple displays, and application-specific functions designed in from the start.
I/O configuration & modular accessories
Tailored interface and expansion mixes — DP/HDMI, USB, LAN, COM, digital I/O, Mini PCIe, M.2, and field interfaces — configured at the design stage rather than worked around later.
All-in-one system integration
Fully integrated systems from industrial PCs and HMI to AI machine vision and medical-grade platforms. Specialized hardware, ruggedized enclosures, embedded OS, and interoperability with cameras, sensors, and AI accelerators for vertical applications.
Ruggedization & thermal design
Variants for harsh conditions: extended temperature, vibration and shock, enclosure protection, plus proven thermal modules, custom heat-sink/cooler solutions, and system thermal simulation for reliable dissipation under heavy workloads.
Embedded software & BIOS support
Embedded OS development, software API and driver support, and BIOS/UEFI firmware optimization — including boot-screen personalization and pre-installed embedded Windows or Linux (Windows 10 IoT, Ubuntu, Yocto Project, and more).
Certification & validation support
Functionality, reliability/safety, thermal profile, electrostatic signal compatibility, and certification tests as part of the design-to-launch flow. Specific certifications for your market are confirmed during consultation.
04 — Future-proof modularization
How does modular design keep systems upgradeable?
Axiomtek embedded solutions use modular and slot-in form factors so features can be arranged for customer-specific requirements, while parts stay easy to install, service, remove, or upgrade. Modularization increases future-proof scalability — new functions can be added later without redesigning the entire system.
01
Power modules
60W, 90W, 120W
02
Storage devices
SSD, mSATA, CFast
03
Carrier boards
Application-specific carriers
04
Memory modules
System memory options
05
ZIO modules
Mini PCIe, USB, COM, LAN
06
Embedded boards
3.5″ SBC, Pico-ITX, COM Express
07
I/O boards
DP/HDMI, USB, LAN
08
Thermal solution
Heatsink, cooler, system enclosure
09
Embedded modules
Mini card for DIO, CAN, Wi-Fi
05 — Thermal & embedded software
How are thermal design and software handled in design-in?
Heavy workloads need reliable dissipation and a software stack that matches the deployment. Axiomtek thermal design services cover proven modules, custom coolers, and simulation; software services cover customized BIOS, embedded OS, and API utility and driver support — with adjustable assistance from micro- to full customization to lower total cost of ownership.
Customized thermal solution
Heat sink or cooler solutions customized to a modularized thermal concept for your chassis and workload.
System thermal simulation
Thermal simulation to evaluate airflow and heat transfer for optimal thermal performance before production.
Comprehensive software support
Beyond hardware, design services include embedded OS development, software API utility and driver support, and BIOS/UEFI firmware optimization. Customers can personalize the boot-up screen or request boards pre-installed with an embedded Windows OS for a ready-to-use interface.
- BIOSCustomized BIOS / UEFI and boot branding
- OSWindows 10 IoT, Linux Ubuntu, Yocto Project (YP), and more
- APIAPI utility and driver support for integration
- TCOAdjustable assistance — full, semi-, or micro-customization to match in-house design capacity
06 — Design & manufacturing from concept to launch
How does the OEM/ODM design-in process work?
Highly skilled engineers and product managers in mechanical, electrical, and industrial design participate from concept incubation through design, debug, validation, production, shipping, and post-manufacturing support. Ideas, specifications, and component selection are integrated with attention to processing speed, storage, noise, ventilation, data acceleration, and peripheral arrangement — minimizing design uncertainty and risk on the path to market.
- Step 01
Initial planning
Product selection, domain knowledge sharing, and comprehensive requirement capture. Axiomtek Malaysia reviews your application, volume, and timeline before engineering scope is locked.
- Step 02
Design
Schematic and layout review, thermal design, BIOS/EOS customization, and mechanical/system design. Scope can scale from micro-customization (minor board changes) to full custom design-in.
- Step 03
Debug
Power on/off testing, phenomenon depuration, analysis and verification, plus solutions and engineering suggestions before validation.
- Step 04
Validation
Functionality, reliability and safety, thermal profile tests, electrostatic signal compatibility, and certification tests relevant to your target market.
- Step 05
Ready to ship
Production test, material maintenance, schedule control, and warranty support — manufacturing with Axiomtek facilities and local support from Axiomtek Malaysia.
Assistance is adjustable: full design-in, semi-customized, or micro-customized support (for example minor motherboard reconfiguration) so teams that design in-house can still lower TCO. Project timelines depend on customization depth and are confirmed during consultation — Axiomtek does not quote a fixed schedule before scope is understood.
07 — Example customization scenarios
What do typical customization projects look like?
Typical OEM/ODM projects start from a gap in standard hardware: a non-standard I/O mix, a certified variant of an existing platform, or a ruggedized build for a harsh deployment environment. The scenarios below are illustrative examples of the kind of requirement this service addresses.
Illustrative examples — not verified case studies
Machine builder, non-standard I/O
A machine builder needs a specific mix of COM ports, digital I/O, and fieldbus interfaces on a compact board that fits an existing control cabinet. No standard SKU carries that combination, so the I/O configuration and modular accessories are designed in from the start.
Transportation integrator, certified variant
A transportation integrator needs a variant certified for its target market and rated for in-vehicle conditions, based on a platform that exists but not in that configuration. The variant is derived from a proven base rather than designed from zero.
Outdoor deployment, ruggedized build
A smart agriculture deployment places computing at the field edge — heat, humidity, and dust included. A ruggedized variant with the right enclosure and thermal design replaces a standard unit that was never meant to live outdoors.
08 — Design inquiry
Start a design inquiry
Send Axiomtek Malaysia your application, estimated volume, and target timeline. The team reviews every inquiry and follows up to arrange a design consultation — no commitment at this stage, and no requirement to have a finished specification.
What happens after you submit
- 01Axiomtek Malaysia reviews your requirement and responds to your work email.
- 02A design consultation is arranged to scope the customization with Axiomtek’s engineers.
- 03Timelines, certifications, and volumes are confirmed before any prototype or production commitment.
09 — FAQ
Frequently asked questions about custom industrial PC design
Buyers most often ask about design timelines, minimum volumes, certification support, and coverage in Malaysia and Singapore. Answers below are general; project-specific timelines and certifications are confirmed during the design consultation.